OEMs, Designers, Chip Suppliers, and often other ESM firms frequently bring complex manufacturing challenges to Betatron for resolution. We focus on the new, complex, double-sided boards that are found in Defense & Aerospace, Leading Edge Servers, Advanced Telecom applications, and High Reliability Medical projects coming out of the advanced design centers today. The increasingly dense population of high value chips on boards in these areas increase the manufacturing challenges dramatically. We have yet to not figure out a solution to complex manufacturing problems; and our value-added capabilities are much greater when we’re able to collaborate with the designers and suppliers early in the process. Our level of technical cooperation with the designer in the setup of the board for assembly often catches issues early and allows the designer to eliminate these issues before they are "built into" the board.